Greater integration of electronics within 3D structures is an ever-increasing trend, representing a more sophisticated solution compared to the current approach of encasing rigid printed circuit boards. In-mold electronics (IME) facilitates this trend, by enabling multiple integrated functionalities to be incorporated into components with thermoformed 3D surfaces.
IME offers multiple advantages relative to conventional mechanical switches, including reduction in weight and material consumption of up to 70% along with a much simpler assembly. Given these benefits, and increasing interest from OEMs, manufacturers, and material suppliers, IDTechEx forecasts IME to be a $1.5 billion market by 2032. Initially are primarily within the automotive and consumer goods sectors but are likely to expand to both aerospace and medical devices.
The webinar will include discussion of the following topics:
- The current status of both IME and similar approaches for creating functional and decorative interfaces across multiple application sectors.
- IME specific material requirements, especially for conductive inks and electrically conductive adhesives.
- Why IDTechEx believe that the value proposition of IME relative to competing methodologies will become more pronounced as embedded electronics become more complex.
There will be a Q&A session at the end of this webinar, where Dr Dyson will answer a few questions that have been sent in.